Movim • Mold 2.0 High Speed Linker Released: Moves From AGPL To MIT License

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people 222 subscribers • Linux Hardware Reviews, Open-Source Benchmarks & Linux Performance

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Mold 2.0 High Speed Linker Released: Moves From AGPL To MIT License

news.movim.eu / Phoronix • 26 July, 2023

Mold 2.0 is out today as a major update to this high performance linker developed by Rui Ueyama. Mold has consistently shown to outperform GNU's Gold and LLVM's LLD linkers while today is making another shift with it now turning to MIT licensing...

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